Dear Larisa

Attached, please find the paper I have mentioned.

If it is possible, this could be considered as the submission date.

Thanks

Eitan

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מאת: Larisa Yang <larisa.yang@mdpi.com>
‏‏נשלח: יום שלישי 28 יוני 2022 23:36
‏‏אל: Eitan Tiferet; Adin STERN; אוהד דולב
עותק: jmmp@mdpi.com
‏‏נושא: Re: [JMMP] Celebrate the CiteScore 2021 — Special Issue "New Innovations in AM - Laser and Electron Beam PBF"

 

Dear Eitan,

Thank you very much for your kind reply. We are pleased to hear that you are willing to recommend a paper from your group. You are free to submit directly to me. Could you please also send us the preliminary manuscript title and abstract when it is prepared, as well as the approximate submission date for us to record?

Looking forward to hearing from you again.

Ms. Larisa Yang
Managing Editor
E-Mail: larisa.yang@mdpi.com

MDPI Branch Office, Wuhan
No.6 Jingan Road, 5.5 Creative Industry Park, 25th Floor, 430064 Wuhan, Hubei Province, China
Tel.: +86 27 8780 8658

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Citescore 2021: 4.8 (Scopus)

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On 2022/6/28 20:01, Eitan Tiferet wrote:
> Dear Larisa If I may, I can recommend a paper from my group. Should > I submit directly to you? Thanks Eitan ------------------------- > *מאת:* Larisa Yang <larisa.yang@mdpi.com> *‏‏נשלח:* יום שני 13 יוני > 2022 04:51:04 *‏‏אל:* Adin STERN; Eitan Tiferet; אוהד דולב *עותק:* > jmmp@mdpi.com *‏‏נושא:* [JMMP] Celebrate the CiteScore 2021 — > Special Issue "New Innovations in AM - Laser and Electron Beam PBF" > > > Dear Adin, Ohad and Tiferet, > > We are excited to share with you the wonderful news that, */JMMP > /received its latest CiteScore of 4.8 from Scopus*, with a > breakthrough increase over Citescore2020 of 2.0. /JMMP /ranks > 144/601 (Q1) in "Mechanical Engineering" category, 91/338 (Q2) in > "Industrial and Manufacturing Engineering" category, 104/384 (Q2) in > "Mechanics of Materials" category; please see the full information > at https://www.scopus.com/sourceid/21100977478. > > We would like to express our sincere gratitude for all of your work > as Guest Editor, which has assisted us in building /JMMP /into a > preferred publication portal for the research community. It is only > with the valuable contributions of you that we have achieved this > goal! > > Attachments are the new banner and flyer of our Special Issue. > Please join us to celebrate the progress, and share this good news in > your community. > > To celebrate the new CiteScore, we would like to grant extra > discounts for our Special Issue. *We will select 50 researchers who > may be interested in our Special Issue, to publish their research > free of charge*. Could you please recommend some potential authors > from your network to contribute to this Special Issue? > > We also have announced this news in the social media. We kindly > invite you to interact and share this news on your own social media. > > https://www.linkedin.com/feed/update/urn:li:activity:6940958741840171009/ > > > > > > Thanks for your support. We look forward to better collaboration with you to develop the special issue.
> > Best regards, Larisa > > Ms. Larisa Yang Managing Editor Journal of Manufacturing and > Materials Processing (http://www.mdpi.com/journal/jmmp) > > Citescore 2021: 4.8 (Scopus) > > To submit to JMMP click here: > http://susy.mdpi.com/user/manuscripts/upload?journal=jmmp. To edit a > Special Issue in JMMP, please send your proposal via: > https://www.mdpi.com/journalproposal/sendproposalspecialissue/jmmp > > Twitter: @JMMP_MDPI LinkedIn: www.linkedin.com/company/jmmp-mdpi/ On > 2022/6/9 14:18, Daniel Chen wrote: >> Dear Ahmed & Steffen, >> >> I hope all is well. I am writing to tell you that I am leaving >> MDPI to pursue another career in my life. It has been a great honor >> and pleasure to work with you these days. Ms. Larisa Yang >> (larisa.yang@mdpi.com, in cc), who is a very experienced editor in >> JMMP, will take over the special issue. Please do not hesitate to >> contact her in case of any questions. >> >> https://www.mdpi.com/journal/jmmp/special_issues/Precision_AM >> >> Thanks again for your support and cooperation in the past and wish >> you all the best in the future. >> >> Kind regards, Daniel >>