Date : 7/18/2022 3:51:10 AM
From : "JMMP Editorial Office"
To : "Eitan Tiferet"
Cc : "Dor Braun" , "Yaron Itay Ganor" , "Shmuel Samuha" , "Gilad Guttman" , "Michael Chonin" , "Nachum Frage" , "Shmuel Hayun" , "Eitan Tiferet" , "JMMP Editorial Office"
Subject : [JMMP] Manuscript ID: jmmp-1845367 - Article Processing Charge Confirmation

Dear Dr. Tiferet,

Thank you very much for submitting your manuscript to Journal of
Manufacturing and Materials Processing:

Journal name: Journal of Manufacturing and Materials Processing
Manuscript ID: jmmp-1845367
Type of manuscript: Article
Title: A Design of Experiment Approach for Development of Electron Beam
Powder Bed Fusion Process Parameters and Improvement of Ti-6Al-4V As-built
Properties
Authors: Dor Braun, Yaron Itay Ganor, Shmuel Samuha, Gilad Guttman, Michael
Chonin, Nachum Frage, Shmuel Hayun, Eitan Tiferet *
Received: 17 July 2022
E-mails: dorb@rotemi.co.il, yarong@nrcn.gov.il, samuha@post.bgu.ac.il,
gilad.guttmann@gmail.com, michaelc@rotemi.co.il, nfrage@bgu.ac.il,
hayuns@bgu.ac.il, eitant@nrcn.gov.il
New Innovations in AM - Laser and Electron Beam PBF
https://www.mdpi.com/journal/jmmp/special_issues/Laser_and_Electron_Beam_PBF

We confirm that, if accepted for publication, the following Article
Processing Charges (APC), 0 CHF, will apply to your article:

Journal APC: 1600 CHF
Voucher Discount: 1600 CHF
Total APC: 0 CHF
Please confirm that the APC is correct at the below link:
https://susy.mdpi.com/user/manuscripts/apc_info/5aabcc18d91e93986f20bf50c4828317

You may be entitled to a discount if you have previously received a discount
code. Please note that reviewer vouchers must be applied before acceptance
for publication. Vouchers cannot be applied once an APC invoice has been
issued. Reviewer vouchers, IOAP discounts, and vouchers offered by the
Editorial Office cannot be applied to one invoice at the same time. You need
to select one type of voucher to use. If you need to add any discount or
replace the current discount with another type of discount, please contact
the JMMP Editorial Office as soon as possible.

Please confirm that you support open access publishing, which allows
unlimited access to your published paper and that you will pay the Article
Processing Charge if your manuscript is accepted.

Thank you in advance for your cooperation. I look forward to hearing from you.



Kind regards,
Ms. Larisa Yang
Managing Editor
E-Mail: larisa.yang@mdpi.com

MDPI Branch Office, Wuhan
No.6 Jingan Road, 5.5 Creative Industry Park, 25th Floor, 430064 Wuhan, Hubei
Province, China
Tel.: +86 27 8780 8658
--
MDPI
JMMP Editorial Office
St. Alban-Anlage 66, 4052 Basel, Switzerland
E-Mail: jmmp@mdpi.com
http://www.mdpi.com/journal/jmmp/

Citescore 2021: 4.8 (Scopus)

Twitter: https://twitter.com/jmmp_mdpi
LinkedIn: www.linkedin.com/company/jmmp-mdpi/

Journal of Manufacturing and Materials Processing (JMMP, 2504-4494) is an
international, peer-reviewed, open access journal on the scientific
fundamentals and engineering methodologies of manufacturing and materials
processing.

JMMP has been indexed by indexed within Scopus, ESCI (Web of Science),
Inspec, CAPlus / SciFinder, and many other databases. JMMP received its
latest CiteScore of 4.8 from Scopus, ranking 144/601 (Q1) in "Mechanical
Engineering" category, 91/338 (Q2) in "Industrial and Manufacturing
Engineering" category, 104/384 (Q2) in "Mechanics of Materials" category; see
the full information at https://www.scopus.com/sourceid/21100977478.



Disclaimer: The information contained in this message is confidential and
intended solely for the use of the individual or entity to whom they are
addressed. If you have received this message in error, please inform us by an
email reply and then delete the message. You may not copy this message in its
entirety or in part, or disclose its contents to anyone.