Date : 12/22/2022 6:05:07 AM
From : "卞華康"
Subject : Subject: [Metals] - Special Issue “Emerging Metallic Systems for Powder Bed Fusion Additive Manufacturing” - Welcome Your Submission (Deadline: 31 March 2023)


Dear Colleagues,

 

I hope this email finds you well.

 

I am Dr. Huakang Bian (School of Engineering, Tohoku University, Japan) who is serving as the Guest Editor for a high-impact Special Issue entitled "Emerging Metallic Systems for Powder Bed Fusion Additive Manufacturing" which will be published in the journal, Metals (ISSN 2075-4701, Impact Factor = 2.695).

 

We would like to invite you to provide a submission for this Special Issue as we believe that you could make an excellent contribution based on your expertise in this area.

 

The submission deadline is *31 March 2023*. You may send your manuscript now or at any time until the deadline. We also encourage you to send a short abstract or tentative title in advance to our Editorial Office at stojkanovic@mdpi.com.

 

To submit your paper, please click the top right button "Submit to Special Issue" using the link below:

 

https://www.mdpi.com/journal/metals/special_issues/Emerging_Metallic_Systems_for_Powder_Bed_Fusion_Additive_Manufacturing

 

Please note, papers that form part of a Special Issue are published online in the journal immediately after peer review and acceptance. This means that there is no delay for authors who submit their work even when other papers in this Special Issue are still being processed.

 

Moreover, publications in Metals will be available online free of charge to all readers, thus gaining a wider readership and more citations. The Article Processing Charge per accepted paper is 2000 Swiss Francs, and this covers the costs associated with the editorial publication and production.

 

Authors from the MDPI Institutional Open Access Program may also enjoy a certain discount. For detailed information, please check the following link:

 

http://www.mdpi.com/about/ioap

 

Should you have any questions or suggestions, please let me know. In the hope that this topic is of interest, we look forward to our future collaboration.

 

Kind Regards,

Guest Editor

Dr. Huakang Bian
School of Engineering, Tohoku University, Sendai 980-8576, Japan