Date : 8/24/2022 6:18:38 AM
From : "Ms. Cassia Li/MDPI"
Cc : "Bartłomiej Wysocki" , joseph.p.buhagiar@um.edu.mt
Subject : Your reply will be highly appreciated: [Materials-SCIE] (IF: 3.748) Special Issue: Design and Post Processing for Metal Additive Manufacturing

Dear Authors,

We invited you to contribute a paper to the following special issue in
July, with a 800-400 CHF discount. Would you please reply if you would
be interested to submit a paper?

"Design and Post Processing for Metal Additive Manufacturing"
https://www.mdpi.com/journal/materials/special_issues/Des_Post_Metal_AM

If you would like to accept this paper invitation, please let us know as
soon as possible. If you are unable to accept our invitation, we hope
you will mention this Special Issue to any colleagues and friends in the
relevant research field.

We appreciate your time and look forward to hearing from you soon.

Kind regards,
Ms. Cassia Li, M.Sc.
Section Managing Editor
Skype: live:b032892e8a447f78
WeChat: 15001070043
Submit your papers to journal Materials
(https://www.mdpi.com/journal/materials)
Follow Materials in Facebook: https://www.facebook.com/MaterialsMDPI

4th International Conference on Materials: Advanced and Emerging
Materials (19–21 Oct 2022, Spain) is now open for registrations and
paper submissions. More details can be found following the
link:https://icm2022.sciforum.net/

Disclaimer: The information and files contained in this message are
confidential and intended solely for the use of the individual or entity
to whom they are addressed. If you have received this message in error,
please notify me and delete this message from your system. You may not
copy this message in its entirety or in part, or disclose its contents
to anyone.

On 2022/7/13 16:29, Ms. Cassia Li/MDPI wrote:
> Dear Authors,
>
> I am glad to contact you again. As we have not heard from you, we
> are sending this email in case you missed our previous message. We
> recently invited you to publish your good paper in our Special Issue
>  “Design and Post Processing for Metal Additive Manufacturing”. More
>  details could be checked by the following link:
>
> https://www.mdpi.com/journal/materials/special_issues/Des_Post_Metal_AM
>
>
>
>
Submission deadline: 10 December 2022
>
> To celebrate the IF increased to 3.748, the Editorial Office can
> offer a special discount for papers submitted prior to the deadline:
>
> 800 CHF for manuscripts submitted before 31 July 2022; 600 CHF for
> manuscripts submitted before 31 August 2022; 400 CHF for manuscripts
>  submitted before 20 September 2022.
>
> If you are interested in making a contribution, please reply to this
> email directly to receive further information about the discounts.
>
> Thank you very much for your consideration. We look forward to
> hearing from you soon.
>
> Kind regards, Ms. Cassia Li, M.Sc. Section Managing Editor Skype:
> live:b032892e8a447f78 WeChat: 15001070043 Submit your papers to
> journal Materials (https://www.mdpi.com/journal/materials) Follow
> Materials in Facebook: https://www.facebook.com/MaterialsMDPI
>
> 4th International Conference on Materials: Advanced and Emerging
> Materials (19–21 Oct 2022, Spain) is now open for registrationsand
> paper submissions. More details can be found following the
> link:https://icm2022.sciforum.net/
>
> Disclaimer: The information and files contained in this message are
> confidential and intended solely for the use of the individual or
> entity to whom they are addressed. If you have received this message
>  in error, please notify me and delete this message from your system.
>  You may not copy this message in its entirety or in part, or
> disclose its contents to anyone.
>
> On 2022/6/15 15:17, Ms. Cassia Li/MDPI wrote:
>> Dear Authors,
>>
>> The journal Materials is currently running a Special Issue entitled
>> "Design and Post Processing for Metal Additive Manufacturing". Dr.
>> Bartłomiej Wysocki, Prof. Joseph Buhagiar, and Dr. Tomasz Durejko
>> are serving as Guest Editors for this issue. We think you could
>> make an excellent contribution based on your expertise.
>>
>> Please check the Special Issue website at:
>> https://www.mdpi.com/journal/materials/special_issues/Des_Post_Metal_AM
>>
>>
>>
>>
>>
>>
Submission deadline: 10 December 2022
>>
>> As the Real-Time IF increased to 3.637, the Editorial Office can
>> offer a special discount for papers submitted prior to the
>> deadline:
>>
>> 800 CHF for manuscripts submitted before 31 July 2022; 600 CHF for
>>  manuscripts submitted before 31 August 2022; 400 CHF for
>> manuscripts submitted before 31 October 2022.
>>
>> Publishing in Materials (ISSN 1996-1944,
>> http://www.mdpi.com/journal/materials) has the following benefits:
>>
>> 1. Open access journal on materials science. 2. High
>> visibility—indexed by SCIE, EI, Scopus, etc. 3. Impact Factor of
>> 3.623 (2020). 4. A first decision is provided to authors
>> approximately 15 days after submission, following peer review.
>>
>> As an open access journal, we have an Article Processing Charge
>> (APC) for accepted papers of CHF 2300 (more details about the APC:
>>  https://www.mdpi.com/journal/materials/apc).
>>
>> If you are interested in making a contribution, please reply to
>> this email directly to receive further information about the
>> discounts.
>>
>> I look forward to hearing from you soon.
>>
>> Kind regards, Ms. Cassia Li, M.Sc. Section Managing Editor Skype:
>> live:b032892e8a447f78 Submit your papers to journal Materials
>> (https://www.mdpi.com/journal/materials) Follow Materials in
>> Facebook: https://www.facebook.com/MaterialsMDPI
>>
>> 4th International Conference on Materials: Advanced and Emerging
>> Materials (19–21 Oct 2022, Spain) is now open for registrationsand
>>  paper submissions. More details can be found following the
>> link:https://icm2022.sciforum.net/
>>
>> Disclaimer: The information and files contained in this message are
>> confidential and intended solely for the use of the individual or
>> entity to whom they are addressed. If you have received this
>> message in error, please notify me and delete this message from
>> your system. You may not copy this message in its entirety or in
>> part, or disclose its contents to anyone.